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The wiring board and the sintered body 发明授权

2023-01-17 4570 116K 0

专利信息

申请日期 2025-07-31 申请号 JP2005093939
公开(公告)号 JP4959950B2 公开(公告)日 2012-06-27
公开国别 JP 申请人省市代码 全国
申请人 KYOCERA CORP
简介 PROBLEM TO BE SOLVED : To provide a sintered compact having a sufficiently densified surface, and having excellent dimensional precision, to provide a wiring board, and to provide a method for producing the same. SOLUTION : The sintered compact 1 comprises at least one kind selected from boron, an alkali element(s) and an alkaline-earth element(s), and is obtained by being fired at ≤1, 050°C. The content of the boron, alkali element(s) or alkaline earth element(s) in the surface layer 1b of the sintered compact is higher than that at the inside 1a of the sintered compact. COPYRIGHT : (C)2007, JPO&INPIT


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