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POLISHING PAD 发明申请

2023-08-01 2610 44K 0

专利信息

申请日期 2025-06-25 申请号 JP2010250025
公开(公告)号 JP2012101298A 公开(公告)日 2012-05-31
公开国别 JP 申请人省市代码 全国
申请人 RITSUMEIKAN; CRYSTAL KOGAKU KK
简介 PROBLEM TO BE SOLVED : To provide a polishing pad whose temporary retaining force for an abrasive material used for polishing a lens, silicon wafer, glass substrate, etc. is improved to reduce an amount of use of a rare earth substance (rare metal), such as cerium, and improve polishing efficiency. SOLUTION : The polishing pad 1 is made by applying or impregnating a nonwoven fabric base material 2 composed of fiber with an epoxy resin 3 with (A) hardness of 70 to 100, or by using the nonwoven fabric base material 2 where an epoxy group is contained in the its surface. COPYRIGHT : (C)2012, JPO&INPIT


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