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POLISHING COMPOSITION, PRODUCING METHOD THEREFOR AND POLISHING METHOD USING THE SAME 发明申请

2023-01-05 4330 246K 0

专利信息

申请日期 2025-07-12 申请号 JP2010253764
公开(公告)号 JP2012101341A 公开(公告)日 2012-05-31
公开国别 JP 申请人省市代码 全国
申请人 ADMATECHS CO LTD
简介 PROBLEM TO BE SOLVED : To provide a polishing composition (polishing slurry) that enables efficient and inexpensive precision polishing. SOLUTION : The polishing composition is composed of abrasive grain and a dispersion medium for dispersing the abrasive grain, and used for polishing the material to be polished. The abrasive grain comprises a crashed particle having a volume-average particle diameter of 0.01-5 μm and composed of a crushed particle of inorganic material. The dispersion medium is an alkaline dispersion medium. The crushed particle used for the polishing composition is preferably crushed silica particle obtained by crushing quartz glass. Excellent stable polishing with small surface roughness can be performed at high polishing rate by using the polishing slurry. The polishing composition does not require rare earth or the like, thereby reducing the cost of the abrasive grain and the cost of polishing slurry. COPYRIGHT : (C)2012, JPO&INPIT


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