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Method for manufacturing semiconductor device 发明授权

2023-08-18 3700 424K 0

专利信息

申请日期 2025-07-22 申请号 JP2001022386
公开(公告)号 JP4939690B2 公开(公告)日 2012-05-30
公开国别 JP 申请人省市代码 全国
申请人 SEMICONDUCTOR ENERGY LAB
简介 A semiconductor device is manufactured by a method in which the number of heat treatments at a high temperature (600° C. or higher) is reduced to thereby achieve a process at a low temperature (600° C. or lower), and a simplified process and improvement in throughput are realized. An impurity region to which a rare gas element (also called a rare gas) is added is formed on a semiconductor film of a crystalline structure by using a mask. Gettering is performed in such a manner that a metallic element contained in the semiconductor film is caused to segregate in the impurity region by heat treatment. The impurity region is thereafter used as a source or drain region.


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