客服热线:18202992950

PLATING JIG FOR ELECTRONIC PARTS AND ELECTROLYSIS PLATING APPARATUS 发明授权

2023-09-24 3720 366K 0

专利信息

申请日期 2025-06-28 申请号 KR1020040081459
公开(公告)号 KR101153276B1 公开(公告)日 2012-05-30
公开国别 KR 申请人省市代码 全国
申请人 SHINKO ELECTRIC INDUSTRIES CO LTD
简介 The invention aims to provide a tool for plating electronic parts capable of relaxing the control of each length of leads and earth leads forming electronic parts. The tool for plating electronic parts positions a plurality of electronic parts each composed of a base where leads inserted into through holes formed at the flat part of a metallic member are sealed with an insulating material and earth leads 18 whose one end part is joined thereto, and applies electroplating to the whole face of the exposed face in each member. The plating tool is provided with : a power supply member 34 arranged on one side of a pedestal 32 where a plurality of magnets 30 are disposed so as to be sealed at prescribed intervals in such a manner that each tip of the leads and earth leads is attracted; sphericalbodies 36 of a magnetic substance connected to the power supply member and in which part of each tip of the leads and earth leads attracted by each magnet is simultaneously abutted on the spherical face; and a guide board 42 at which guide holes 44 are formed for guiding each tip of the leads and earth leads to the corresponding spherical body 36.


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4