| 申请日期 | 2025-06-27 | 申请号 | JP2011540842 |
| 公开（公告）号 | JP2012511834A | 公开（公告）日 | 2012-05-24 |
| 公开国别 | JP | 申请人省市代码 | 全国 |
| 申请人 | APPLIED MATERIALS INCORPORATED | ||
| 简介 | A filled polymer composition having improved plasma resistance is disclosed. The composition includes a particle filler dispersed in a polymer matrix. The particle filler can be Nb2O5, YF3, AlN, SiC or Si3N4 and rare earth oxides. In an embodiment, the composition is utilized as a bonding adhesive for electrostatic chuck, bonding adhesive for shower head, bonding adhesive for liner, sealing material, O-ring, or plastic component. | ||
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