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Method for manufacturing semiconductor device 发明授权

2023-04-15 5160 406K 0

专利信息

申请日期 2025-09-17 申请号 JP2001016314
公开(公告)号 JP4926321B2 公开(公告)日 2012-05-09
公开国别 JP 申请人省市代码 全国
申请人 SEMICONDUCTOR ENERGY LAB
简介 PROBLEM TO BE SOLVED : To solve the problem that a concentration of an impurity element necessary for gettering is high in a crystallizing method using a metal element to disturb a recrystallization by later annealing. SOLUTION : A method for manufacturing a semiconductor device comprises the steps of forming an impurity region doped with a rare earth element, and gettering the impurity region to segregate the metal element contained in a semiconductor film by heat treating and laser annealing. The method further comprises the steps of irradiating a laser beam above or below a substrate (semiconductor substrate) in which the semiconductor film is formed to heat a gate electrode, and heating the impurity region to be superposed with a part of the gate electrode by its heat. Thus, the crystallinity of the impurity region to be superposed with the part of the gate electrode can be recovered and the impurity element can be activated.


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