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Fabrication method of light emitting device 发明授权

2023-02-10 4590 854K 0

专利信息

申请日期 2026-03-11 申请号 US13050201
公开(公告)号 US8173469B2 公开(公告)日 2012-05-08
公开国别 US 申请人省市代码 全国
申请人 Kyung Wook Park; Myung Hoon Jung
简介 Provided is a method for fabricating a light emitting device. The method for fabricating the light emitting device includes forming a buffer layer including a compound semiconductor in which a rare-earth element is doped on a substrate, forming a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, which are successively stacked on the buffer layer, forming a first electrode layer on the light emitting structure, removing the substrate, and forming a second electrode layer under the light emitting structure.


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