| 申请日期 | 2025-11-26 | 申请号 | WOJP11072366 |
| 公开（公告）号 | WO2012043717A1 | 公开（公告）日 | 2012-04-05 |
| 公开国别 | WO | 申请人省市代码 | 全国 |
| 申请人 | Hitachi Metals Ltd; KAMACHI Masanao; YOSHIMURA Koshi | ||
| 简介 | In order to address the problem of providing a novel method for forming an electric copper plating film with excellent adhesion on the surface of a rare earth permanent magnet, the method of the present invention is characterized by the immersion of a magnet in plating solution, followed by the application of 0.05A/dm2-4.0A/dm2 as the cathode current density for electric copper plating for 10-180 s, to commence processing. | ||
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