| 申请日期 | 2025-07-10 | 申请号 | US14279601 |
| 公开（公告）号 | US10262951B2 | 公开（公告）日 | 2019-04-16 |
| 公开国别 | US | 申请人省市代码 | 全国 |
| 申请人 | Jin Ho Kang; Godfrey Sauti; Cheol Park; Luke Gibbons; Sheila Ann Thibeault; Sharon E Lowther; Robert G Bryant | ||
| 简介 | A novel radiation hardened chip package technology protects microelectronic chips and systems in aviation/space or terrestrial devices against high energy radiation. The proposed technology of a radiation hardened chip package using rare earth elements and mulitlayered structure provides protection against radiation bombardment from alpha and beta particles to neutrons and high energy electromagnetic radiation. | ||
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