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MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 发明申请

2023-07-07 1360 191K 0

专利信息

申请日期 2026-04-21 申请号 JP2010175626
公开(公告)号 JP2012038816A 公开(公告)日 2012-02-23
公开国别 JP 申请人省市代码 全国
申请人 FUJITSU SEMICONDUCTOR LTD
简介 PROBLEM TO BE SOLVED : To provide a manufacturing method of a semiconductor device for reducing an etching residue of a high-k film containing rare earth metals. SOLUTION : A manufacturing method of a semiconductor device has steps of : forming an insulation film 4 on a semiconductor substrate 1; forming oxide films 7 and 12 containing rare earth elements on the insulation film 4; and etching the oxide films 7 and 12 containing rare earth elements with a chemical solution containing hydrofluoric acid, hydrochloric acid, and sulfuric acid. By this manufacturing method, the oxide films 7 and 12 containing rare earth elements are excellently etched. COPYRIGHT : (C)2012, JPO&INPIT


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