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METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE 发明申请

2023-09-12 3990 3370K 0

专利信息

申请日期 2025-09-02 申请号 US13183996
公开(公告)号 US20120045876A1 公开(公告)日 2012-02-23
公开国别 US 申请人省市代码 全国
申请人 Takaaki KAWAHARA; Shinsuke Sakashita; Masaru Kadoshima; Hiroshi Umeda
简介 There is provided a technology capable of preventing the increase in threshold voltages of n channel type MISFETs and p channel type MISFETs in a semiconductor device including CMISFETs having high dielectric constant gate insulation films and metal gate electrodes. When a rare earth element or aluminum is introduced into a Hf-containing insulation film which is a high dielectric constant gate insulation film for the purpose of adjusting the threshold value of the CMISFET, a threshold adjustment layer including a lanthanum film scarcely containing oxygen, and a threshold adjustment layer including an aluminum film scarcely containing oxygen are formed over the Hf-containing insulation film in an nMIS formation region and a pMIS formation region, respectively. This prevents oxygen from being diffused from the threshold adjustment layers into the Hf-containing insulation film and the main surface of a semiconductor substrate.


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