| 申请日期 | 2025-06-27 | 申请号 | WOJP18036971 |
| 公开（公告）号 | WO2019069965A1 | 公开（公告）日 | 2019-04-11 |
| 公开国别 | WO | 申请人省市代码 | 全国 |
| 申请人 | C UYEMURA CO LTD | ||
| 简介 | The present invention addresses the problem of providing an electroless palladium plating solution that yields a Pd plating film that constitutes a plated film that exhibits an excellent wire bondability even after a thermal history. The electroless palladium plating solution according to the present invention comprises a palladium compound, a reducing agent, a complexing agent, and at least one type selected from the group consisting of Ge and rare earth elements. | ||
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