| 简介 |
Polishing agent (A) comprises water, abrasive agent and/or colloid, methyl glycine diacetic acid or a disuccinate compound (I), and an alkali salt or alkaline earth salt of gluconic acid. Polishing agent (A) comprises water, abrasive agent and/or colloid, methyl glycine diacetic acid or a disuccinate compound of formula (I), and an alkali salt or alkaline earth salt of gluconic acid. R : (NH-CH 2-CH 2-) nNH; X : H and/or alkali metal; and n : 0-2. An independent claim is included for a process of polishing a semiconductor disc with a front, a back and an edge comprising using the polishing agent. |
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