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Molten lead-free solder Fe base alloy having excellent resistance to corrosion by lead-free solderin 发明授权

2023-11-24 4650 231K 0

专利信息

申请日期 2025-06-28 申请号 JP2005220329
公开(公告)号 JP4857641B2 公开(公告)日 2012-01-18
公开国别 JP 申请人省市代码 全国
申请人 Mitsubishi Materials Corp6264
简介 PROBLEM TO BE SOLVED : To provide an Fe-based alloy excellent in resistance to attack by lead-free solder, especially Sn-Ag lead-free solder in a molten state and to provide a member made of the Fe-based alloy for a lead-free soldering apparatus. ŽSOLUTION : The Fe-based alloy has a composition of 15 to 48% Co, 13 to 28% Cr, 0.2 to 3.5% Si, 0.05 to 0.4% Al, 0.02 to 2% Mn, 0.02 to 0.5% C, 0.01 to 0.3% N, and optionally one or more elements of the following (a) to (c), with the balance comprising Fe and inevitable impurities : (a) 1 to 10% in total at least either of W and Mo, (b) 0.1 to 3% in total at least either of Nb and Ta, and (c) 0.001 to 0.3% in total at least either of Y and a rare earth element. ŽCOPYRIGHT : (C)2007, JPO&INPIT Ž


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