| 简介 |
The present invention relates to a method for the production of a sensor module for measuring acceleration, pressure or magnetic fields and the like. It comprises the steps of -arranging at least a micro-electromechanical element on a first integrated circuit, with a contact surface of a micro-electromechanical element -contacting at least one of said metallic support, in particular by means of wire bonding, -and in particular the wire bonding a-live at least of the integrated circuit, by means of at least one of the integrated circuit contact at least -rewiring layer., in particular with a contact surface. |
客服热线：
手机版
二维码
