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Under the temperature stability of the adhesive layers bonding of members (Bauteilen) 发明申请

2023-10-28 4520 124K 0

专利信息

申请日期 2025-06-26 申请号 JP2011524335
公开(公告)号 JP2012500878A 公开(公告)日 2012-01-12
公开国别 JP 申请人省市代码 全国
申请人 ROBERT BOSCH GMBH
简介 A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ≧100° C. to ≰160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system includes an epoxy resin component and polymer particles dispersed in the epoxy resin component, the dispersed polymer particles furthermore including addition-crosslinked silicone elastomer. Also provided is the use of a reactive resin system for gluing piezoelectric ceramics and/or permanent magnets including rare earth elements and a component configuration including a piezoelectric ceramic, an impedance matching layer and an adhesive layer in contact with the piezoelectric ceramic and the impedance matching layer.


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