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Without causing thermal defect for a liquid crystal display device excellent in adhesion and their w 发明授权

2023-09-26 2570 254K 0

专利信息

申请日期 2025-06-27 申请号 JP2007027808
公开(公告)号 JP4840173B2 公开(公告)日 2011-12-21
公开国别 JP 申请人省市代码 全国
申请人 Mitsubishi Materials Corp6264
简介 PROBLEM TO BE SOLVED : To provide a laminated wiring and a laminated electrode for liquid crystal display device which is composed of a thin copper alloy laminated film excellent in adhesion to a glass substrate surface without causing any thermal defect such as hillock or void, and to provide a method for forming them. ?SOLUTION : The laminated wire and the laminated electrode are formed of a composite copper alloy layer formed by laminating a thin copper alloy film having the composition containing a total of 0.01-2 atom % of one or two or more kinds out of rare earth elements, 0.05-2 atom % of Ag, and the balance Cu with inevitable impurities, and an oxygen-containing thin copper alloy film having the composition containing a total of 0.01-2 atom % of one or two or more kinds out of rare earth elements, 0.05-2 atom % of Ag, and 0.02-2 atom % O, and the balance Cu with inevitable impurities. ?COPYRIGHT : (C)2008, JPO&INPIT ?


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