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AQUEOUS ALKALINE ETCHING AND CLEANING COMPOSITION AND METHOD FOR TREATING THE SURFACE OF SILICON SUB 发明申请

2023-07-17 4210 349K 0

专利信息

申请日期 2025-07-28 申请号 WOIB11052418
公开(公告)号 WO2011154875A1 公开(公告)日 2011-12-15
公开国别 WO 申请人省市代码 全国
申请人 BASF SE; BASF (CHINA) COMPANY LIMITED; FERSTL Berthold; BRAUN Simon; FEßENBECKER Achim
简介 An aqueous alkaline etching and cleaning composition for treating the surface of silicon substrates, the said composition comprising : (A) a quaternary ammonium hydroxide; and (B) a component selected from the group consisting of water-soluble acids and their water-soluble salts of the general formulas (I) to (V) : (R1-S03-)nXn+ (I), R-P032- (Xn+)3-n (II); (RO-S03-)nXn+ (III), RO-P032- (Xn+)3-n, (IV), and [(RO)2P02-] nXn+ (V); wherein the n = 1 or 2; X is hydrogen or alkaline or alkaline-earth metal; the variable R1 is an olefinically unsaturated aliphatic or cycloaliphatic moiety and R is R1 or an alkylaryl moiety; the use of the composition for treating silicon substrates, a method for treating the surface of silicon substrates, and methods for manufacturing devices generating electricity upon the exposure to electromagnetic radiation.


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