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COPPER-BASED ALLOY AND STRUCTURAL MATERIAL COMPRISING SAME 发明申请

2023-06-26 3710 1430K 0

专利信息

申请日期 2025-06-27 申请号 WOJP11002966
公开(公告)号 WO2011152009A1 公开(公告)日 2011-12-08
公开国别 WO 申请人省市代码 全国
申请人 Japan Copper Development Association; ARAKI Yoshikazu; OMORI Toshihiro; SUTOU Yuji; KOETAKA Yuji; IKAGO Kohju; KAINUMA Ryosuke; ISHIDA Kiyohito; KUSAMA Tomoe
简介 Disclosed are : a copper-based alloy which contains 7.8 to 8.8 mass% of Al, 7.2 to 14.3 mass% of Mn and a remainder made up by Cu and unavoidable impurities, has a largest crystal grain diameter of more than 8 mm, has good shape memory properties, and enables the production of a structural material having a cross-section size suitable for use as a structure body or the like; and a structural material comprising the copper-based alloy. The copper-based alloy may additionally contain at least one element selected from the group consisting of Ni, Co, Fe, Ti, V, Cr, Si, Ge, Nb, Mo, W, Sn, Bi, Sb, Mg, P, Be, Zr, Zn, B, C, S, Ag and a mischmetal in the total amount of 0.001 to 5 mass%.


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