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RELEASE FILM FOR MOLDING MOLDING AND METHOD FOR PRODUCING THE SAME 发明申请

2023-02-23 2860 111K 0

专利信息

申请日期 2025-06-27 申请号 JP2010100761
公开(公告)号 JP2011230320A 公开(公告)日 2011-11-17
公开国别 JP 申请人省市代码 全国
申请人 DAINIPPON PRINTING CO LTD
简介 PROBLEM TO BE SOLVED : To provide a release film for molding a molding which has water repellency, mold releasability, gas-barrier properties, and non-transferability, is excellent in followability to a mold, uniform, stable, and reduced in environmental load, and has the vapor deposition film of a fluorine dope organic component-containing organic silicon compound of a low cost and a method for producing the release film. SOLUTION : In the release film which is obtained by forming the vapor deposition film of the fluorine dope organic component-containing organic silicon compound by a plasma chemical vapor phase deposition method (PE-CVD method) and has gas-barrier properties, water repellency, and mold releasability and the method for producing the release film, a fluorinated hydrocarbon compound (fluorocarbon) and an organic silicon compound are made vapor deposition monomer materials, the plasma chemical vapor phase deposition of the vapor deposition film of the organic silicon compound is carried out in a rare gas and/or oxygen gas atmosphere, and finally the vapor deposition film of the fluorine dope organic component-containing organic silicon compound is formed on a plastic base material film to obtain the release film which has a water contact angle of at least 90° at a high speed, is excellent in water repellency and mold releasability, and is also provided with gas-barrier properties. COPYRIGHT : (C)2012, JPO&INPIT


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