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Light emitting device and manufacturing method thereof 发明授权

2023-04-04 3330 408K 0

专利信息

申请日期 2025-07-14 申请号 JP2005131055
公开(公告)号 JP4815860B2 公开(公告)日 2011-11-16
公开国别 JP 申请人省市代码 全国
申请人 Sony Corporation2185
简介 PROBLEM TO BE SOLVED : To provide a light-emitting element with large light emission strength, capable of obtaining emission light having a wavelength with a narrow half width at half maximum. SOLUTION : The light emitting element 10 has a light emission layer 20 formed on a substrate 11. The light emission layer has a structure formed by laminating a first material layer 21, a quantum well layer 24, and a second material layer 22. At least one layer out of the first material layer 21 and the second material layer 22 contains rare-earth element 23. COPYRIGHT : (C)2006, JPO&NCIPI


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