客服热线:18202992950

FILM-FORMING APPARATUS 发明申请

2023-07-22 3820 83K 0

专利信息

申请日期 2025-07-07 申请号 JP2010075087
公开(公告)号 JP2011208191A 公开(公告)日 2011-10-20
公开国别 JP 申请人省市代码 全国
申请人 FUJIFILM CORP
简介 PROBLEM TO BE SOLVED : To provide a film-forming apparatus for forming a film on a substrate by supplying an electric power to a drum while transporting the substrate by winding the substrate onto the drum, which can preferably suppress the abnormal discharge that occurs from the drum at the position at which the substrate begins to be wound onto the drum electrode, or at the position at which the substrate is separated from the drum, can suppress the degradation of a film quality, the damage of the substrate and the like caused by the abnormal discharge, and also can suppress the damage of the substrate caused by fluttering of the substrate. SOLUTION : This film-forming apparatus includes : a platy earth plate 48 which is arranged so as to face the peripheral surface of the drum 30 at the position at which the substrate Z that is wound onto the drum 30 is separated from the drum 30, has an aperture for passing the substrate Z therethrough formed therein, is electroconductive and is grounded; and a transportation roller 22 which guides the substrate Z right after having been separated from the drum 30. The transportation roller 22 is electroconductive and is grounded, and at least one part of the transportation roller 22 is arranged so as to enter into the aperture 48a of the earth plate 48. COPYRIGHT : (C)2012, JPO&INPIT


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4