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THERMOELECTRIC MATERIALS, AND THERMOELECTRIC MODULE AND THERMOELECTRIC DEVICE COMPRISING SAME 发明申请

2023-06-25 4300 387K 0

专利信息

申请日期 2025-06-27 申请号 KR1020100029348
公开(公告)号 KR1020110109562A 公开(公告)日 2011-10-06
公开国别 KR 申请人省市代码 全国
申请人 SAMSUNG ELECTRONICS CO LTD
简介 PURPOSE : Thermoelectric materials, and a thermoelectric module and a thermoelectric apparatus including the same are provided to secure the low thermal conductivity of the materials and to be adopted for a micro cooling system. CONSTITUTION : Thermoelectric materials include a compound represented by chemical formula, (R_(1-a) R'_a)(T_(1-b) T'_b)_(3±y). In the chemical formula, the R and the R' are different and are one or more elements selected from a group including rear earth elements and transition metals. The T and T' are different and are one or more elements from a group including S, Se, Te, P, As, Sb, Bi, C, Si, Ge, Sn, B, Al, Ga, and In. The a and the b are more than or equal to 0 and are less than or equal to 1. The y is more than or equal to 0 and is less than 1. The compound includes a two dimensional layered structure. The bilayer composed of the T is interposed between two block layers composed of the R and the T. COPYRIGHT KIPO 2012


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