客服热线:18202992950

A wiring board and a glass ceramic sintered body using the same 发明授权

2023-06-10 3180 106K 0

专利信息

申请日期 2026-04-25 申请号 JP2001294748
公开(公告)号 JP4748904B2 公开(公告)日 2011-08-17
公开国别 JP 申请人省市代码 全国
申请人 Kyocera Corporation6633
简介 PROBLEM TO BE SOLVED : To obtain a sintered glass-ceramic which can be fired with low- electroresistance metals such as silver, copper and gold, and preferably with the silver, and has a high thermal conductivity and a wiring board having high dimensional accuracy. SOLUTION : The wiring board furnished with an insulating substrate 1 and a wiring layer 2 disposed on the surface of and/or within the same is formed by a sintered glass-ceramic compact which contains, as constitution components, at least Si, Al, rear earth elements (RE), Zn and/or Mg, contains, as a crystal phase, at least one kind selected from the group of gahnite, spinel, forsterite and enstatite and an AlN crystal phase and/or Si3 N4 crystal phase and further, contains a rear earth-containing crystal phase and of which the relative density is >=95% and the thermal conductivity is >=2 W/m.K.


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4