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A neutral particle film forming method of semiconductor device 发明授权

2023-01-17 3190 68K 0

专利信息

申请日期 2025-07-29 申请号 JP2008141566
公开(公告)号 JP4743229B2 公开(公告)日 2011-08-10
公开国别 JP 申请人省市代码 全国
申请人 Tohoku University504157024; Semiconductor Technology Academic Research Center Inc396023993
简介 PROBLEM TO BE SOLVED : To provide a semiconductor device film forming method using neutral particles, which can suppress gas dissociation due to high-energy electrons or UV light and can form an excellent film having a planned molecular structure. ŽSOLUTION : The method includes steps of exciting a rare gas to generate plasma, imparting an electric field to the charged particles in the plasma to impart a predetermined energy, and neutralizing the charged particles to generate a neutral particle beam NB, irradiating the material gas with the neutral particle beam NB having a controlled energy, dissociating the predetermined molecules to dissociate, and forming a film 30 on a substrate 14. ŽCOPYRIGHT : (C)2010, JPO&INPIT Ž


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