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Process for the fabrication of a hole 检索报告

2023-01-27 1600 95K 0

专利信息

申请日期 2025-06-27 申请号 EP10007027
公开(公告)号 EP2230041A3 公开(公告)日 2011-08-03
公开国别 EP 申请人省市代码 全国
申请人 SIEMENS AKTIENGESELLSCHAFT
简介 Production of a hole (7) in a component (1) using pulsed laser beams comprises using other laser pulse lengths in the first process steps than in the last process step. Preferred Features : Larger or smaller laser pulse lengths are used in the first process step than in the last process step. The laser pulse length is continuously enlarged during the progress of the hole formation from an outer surface (14) of the component to the depth of the hole. The component is a layer system consisting of a substrate (4) and a metallic layer (16) having a composition MCrAlX (where M = Fe, Co or Ni and X = Y or rare earth).


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