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CONDUCTIVE PASTE AND A METHOD FOR PRODUCING ELECTRONIC COMPONENT 发明申请

2023-08-13 1170 1258K 0

专利信息

申请日期 2025-09-11 申请号 US13006200
公开(公告)号 US20110180198A1 公开(公告)日 2011-07-28
公开国别 US 申请人省市代码 全国
申请人 AMAN SANSHIRO; TAKAGI SATOSHI; KAMADA YUKI
简介 A purpose of the present invention is to provide a conductive paste which is capable to prevent the structural defect and to provide a method for producing electronic components including an internal electrode layer formed by the conductive paste. A conductive paste comprises metallic particles, solvent, rein, a first inhibitor, a second inhibitor and a third inhibitor, wherein sintering start temperatures of the first inhibitor, the second inhibitor and the third inhibitor are higher than a sintering start temperature of the metallic particles, when an average particle size of the first inhibitor is defined as “a”, an average particle size of the second inhibitor is defined as “b”, an average particle size of the third inhibitor is defined as “c”, “a”, “b” and “c” fulfill a predetermined relation.


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