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The method of supplying hydrogen gas into the processing chamber and the deposition equipment 发明授权

2022-12-27 4320 39K 0

专利信息

申请日期 2025-06-27 申请号 JP2001214081
公开(公告)号 JP4729815B2 公开(公告)日 2011-07-20
公开国别 JP 申请人省市代码 全国
申请人 Hitachi Metals Ltd5083
简介 PROBLEM TO BE SOLVED : To provide a method for supplying gaseous hydrogen into a process chamber of a vapor deposition system which is capable of stably forming a vapor deposited metallic film on the surface of a material to be treated, such as a rare earth permanent magnet, by eliminating the adverse influence of the O2 existing in the process chamber even when long-time vapor deposition treatment is performed. SOLUTION : The vapor deposition treatment for depositing the vapor deposited metallic film containing the gaseous hydrogen on at least a portion in the process chamber of the vapor deposition system in the state of not housing the material to be treated in the process chamber is performed and thereafter the material to be treated is housed into the process chamber and the pressure in the process chamber is reduced, by which the gaseous hydrogen is released from the vapor deposited metallic film.


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