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A material for the MEMS device, its manufacturing method, and a material for the MEMS device inclu 发明授权

2023-10-29 4570 862K 0

专利信息

申请日期 2025-06-25 申请号 JP2006155650
公开(公告)号 JP4715641B2 公开(公告)日 2011-07-06
公开国别 JP 申请人省市代码 全国
申请人 Sony Corporation2185
简介 PROBLEM TO BE SOLVED : To accurately prevent interlayer delamination and deterioration of magnetic properties. ŽSOLUTION : A multi-layered material for use in an MEMS (micro electro mechanical system) device in a method of manufacturing the material, and in an MEMS device that includes the material, includes six layers of magnetizable Co-Ni-Re-W-P material, and each adjacent pair of the magnetizable layers has a non-magnetizable, electrically-conductive Cu layer therebetween for each. The material is formed on a seed layer of Au, while the seed layer is formed on a glass substrate coated with a thin Cr coating. The non-magnetizable material layers are approximately 1 μm thick. The Cu layers are also approximately 1 μm thick. ŽCOPYRIGHT : (C)2007, JPO&INPIT Ž


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