申请日期 | 2025-06-26 | 申请号 | US13059502 |
公开(公告)号 | US20110155418A1 | 公开(公告)日 | 2011-06-30 |
公开国别 | US | 申请人省市代码 | 全国 |
申请人 | John W Osenbach | ||
简介 | An electronic device includes a metallic conducting lead having a surface. A pre-solder coating over the surface consists essentially of tin and one or more dopants selected from Al or a rare earth element. |
您还没有登录,请登录后查看下载地址
|