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WOUND TREATMENT APPARATUS EMPLOYING REDUCED PRESSURE 发明申请

2023-03-27 4340 68K 0

专利信息

申请日期 2025-06-27 申请号 JP2011016620
公开(公告)号 JP2011120931A 公开(公告)日 2011-06-23
公开国别 JP 申请人省市代码 全国
申请人 KCI LICENSING INC
简介 PROBLEM TO BE SOLVED : To provide an apparatus for treating injuries to a part of the body, particularly injuries caused by burns. SOLUTION : The wound treatment apparatus includes a porous pad adapted to contact a surface of the wound of a patient; an envelope for surrounding the porous pad to enclose an affected part and having a re-sealable opening that permits the wound to be examined; and a connecting means fluidly connected to the interior of the envelope and a negative pressure source. COPYRIGHT : (C)2011, JPO&INPIT


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