| 申请日期 | 2025-07-09 | 申请号 | JP2003530778 |
| 公开（公告）号 | JP4708701B2 | 公开（公告）日 | 2011-06-22 |
| 公开国别 | JP | 申请人省市代码 | 全国 |
| 申请人 | CABOT MICROELECTRONICS CORPORATION500397411 | ||
| 简介 | The invention provides a method for polishing a substrate comprising a metal layer using a chemical-mechanical polishing system comprising an abrasive and/or polishing pad, a rare earth salt, an oxidizer that is a stronger oxidant than the rare earth salt, and a liquid carrier. | ||
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