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The copper plating film on the surface of a rare earth permanent magnet 发明授权

2023-01-19 2410 40K 0

专利信息

申请日期 2025-07-19 申请号 JP2006004882
公开(公告)号 JP4650275B2 公开(公告)日 2011-03-16
公开国别 JP 申请人省市代码 全国
申请人 Hitachi Metals Ltd5083
简介 PROBLEM TO BE SOLVED : To provide a method for producing a rare earth element based permanent magnet having a copper plating film on the surface thereof, which uses a novel plating solution for an electrolytic copper plating treatment and allows the formation of a copper plating film excellent in adhesiveness on the surface of a rare earth metal based permanent magnet. ?SOLUTION : The method for producing the rare earth element based permanent magnet having a copper plating film on the surface thereof comprises forming a copper plating film on the surface of the rare earth element based permanent magnet by the electrolytic copper plating treatment using the plating solution which is adjusted to have a pH of 9.0 to 11.5 and comprises three components of (1) : a Cu2+ion; (2) a chelating agent exhibiting a chelate stability constant with a Cu2+ion of ≥10.0; and (3) a chelating agent exhibiting a chelate stability constant with an Fe3+ion of ≥16.0, (under a condition that the chelate stability constant is measured at a pH of 9.0 to 11.5). ?COPYRIGHT : (C)2007, JPO&INPIT ?


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