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The cutting device and the cutting method 发明授权

2023-11-07 3410 91K 0

专利信息

申请日期 2025-07-11 申请号 JP2005231411
公开(公告)号 JP4640596B2 公开(公告)日 2011-03-02
公开国别 JP 申请人省市代码 全国
申请人 TDK Corporation3067
简介 PROBLEM TO BE SOLVED : To provide cutting device and cutting method for cutting a cutting object in a stably held state without requiring an adhering process and a peeling process. SOLUTION : This cutting device is provided with clamping parts 2 and 3 for clamping the cutting object (a rare-earth sintered magnet 1) before a cutting and cut pieces 1a after the cutting, and a cutting mechanism 4 (a rotary blade 4a) for cutting the cutting object in the direction orthogonal to the clamping direction by the clamping parts 2 and 3. At the time of the cutting, the rare-earth sintered magnet 1 is clamped by the clamping parts 2 and 3, and the rare earth sintered magnet 1 is cut by moving the rotary blade 4a in the direction substantially orthogonal to the clamping direction, for instance. Also after the cutting, each of the cut pieces 1a is maintained in the clamped state by the clamping parts 2 and 3. After the cutting, the cut pieces 1a are dropped downward by opening the clamping part 2 and 3 and are collected by a storage container 5. COPYRIGHT : (C)2007, JPO&INPIT


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