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A method of forming a silicon compound thin film 发明授权

2023-08-20 2900 88K 0

专利信息

申请日期 2025-07-15 申请号 JP2006301357
公开(公告)号 JP4616237B2 公开(公告)日 2011-01-19
公开国别 JP 申请人省市代码 全国
申请人 Nippon Telegraph and Telephone Corporation4226
简介 PROBLEM TO BE SOLVED : To obtain a desired refractive index and a desired rare earth addition state in depositing a silicon compound thin film such as an SiOxfilm or a SiON film. ?SOLUTION : First, inner pressure is reduced to be the prescribed pressure. Then, gas is introduced from a gas introduction part 106, thereby generating first plasma in a plasma generation chamber 101. Sputter gas such as Ar is introduced from a gas introduction part 133, thereby generating second plasma in a sputter chamber 103. In a state where the two kinds of plasma are generated, a thin film is deposited by a PECVD method on the surface of a substrate 105 arranged in a deposition chamber 102, through the use of the first plasma and silicon source gas to be supplied from a source gas introduction part 107. Simultaneously, a rare earth element target 121 is sputtered with the second plasma in the sputter chamber 103. The elements generated thereby are added to the thin film deposited on the substrate 105. ?COPYRIGHT : (C)2008, JPO&INPIT ?


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