| 简介 |
PROBLEM TO BE SOLVED : To provide a connecting terminal member capable of suppressing or preventing the occurrence of whisker while suppressing the quantity of a rare metal to be used and improving both of solderability (wettability) to lead-free solder and slidability.
SOLUTION : The connecting terminal member is formed by reflowing a multilayer plated material having a first plating layer comprising tin or a tin alloy on the outside of the conductive base material and a second plating layer comprising indium on the first plating layer. The thickness of the first plating layer in a connection/disconnection part of the connecting terminal member is controlled to 0.3-3 μm, the thickness in the soldered part of the connecting terminal member is controlled to be thicker than that of the connection/disconnection part and the thickness of the second plating layer is controlled to 0.05-0.2 μm.
COPYRIGHT : (C)2011, JPO&INPIT |
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