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SUBSTRATE TREATING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME 发明申请

2023-07-31 2460 1527K 0

专利信息

申请日期 2025-06-24 申请号 US12813823
公开(公告)号 US20100317185A1 公开(公告)日 2010-12-16
公开国别 US 申请人省市代码 全国
申请人 VOS RITA; MERTENS PAUL; SCHRAM TOM; WADA MASAYUKI
简介 A substrate treating method comprising a step of preparing a semiconductor substrate (W, 11) which has an oxide film (13, 14) containing at least one of a rare earth oxide and an alkaline earth oxide, at least a portion of the oxide film (13, 14) being exposed, and a rinse step of supplying the oxide film (13, 14) on the semiconductor substrate (W, 11) with a rinse liquid made of an alkaline chemical or an organic solvent. Preferably, the alkaline chemical is an alkaline aqueous solution having a pH of more than 7. Further, preferably, the organic solvent is a high concentration organic solvent having a concentration of substantially 100%.


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