客服热线:18202992950

COMPOSITE DIELECTRIC CERAMIC-CONTAINING POLYMERIZABLE COMPOSITION, RESIN MOLDED PRODUCT, LAMINATE, 发明申请

2023-05-14 3300 68K 0

专利信息

申请日期 2025-09-16 申请号 JP2009125259
公开(公告)号 JP2010270270A 公开(公告)日 2010-12-02
公开国别 JP 申请人省市代码 全国
申请人 NIPPON ZEON CO
简介 PROBLEM TO BE SOLVED : To provide a polymerizable composition and a resin molded product useful for production of a laminate having a high dielectric constant, low dielectric loss tangent, small rate of change in a dielectric constant due to temperature, and also excellent mechanical strength, heat resistance, and crack resistance in a cold-heat shock test, the laminate, and further a dielectric device obtained by using the laminate. SOLUTION : The polymerizable composition contains a cycloolefin monomer, a polymerization catalyst, a crosslinking agent, a crosslinking aid, and composite dielectric ceramics represented by composition formula {Ba6-3x[(La1-wREw)1-yBiy]8+2x}zTi18O36+18z, wherein 0.28≤w≤0.99, 0.5≤x≤0.9, 0.1≤y≤0.27, 0.8≤z≤1.2, and RE is a rare earth element other than La. The resin molded product is obtained by polymerizing the polymerizable composition. The laminate is obtained by laminating the resin molded product and the resin molded product and/or another substrate material and then curing the same. The dielectric device is obtained by using the laminate. COPYRIGHT : (C)2011, JPO&INPIT


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4