| 简介 |
PROBLEM TO BE SOLVED : To provide a material with a plated coating film which can not only improve solderability (wettability) to a lead-free solder but also suppress or prevent the occurrence of a whisker while reducing an amount of a rare metal to be used therein.
SOLUTION : A lead frame 10a is formed of a plated material having a first plated layer 1a formed on an electroconductive substrate 4 and a second plated layer 2a formed on the surface of the first plated layer 1a. The first plated layer 1a includes at least one metal selected from the group consisting of tin, a tin-silver alloy, a tin-bismuth alloy, a tin-copper alloy and a tin-silver-copper alloy. The second plated layer 2a is formed from indium. The thickness of the first plated layer is more than 5 μm and equal to or less than 10 μm, and the thickness of the second plated layer is 0.05-0.4 μm.
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