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CONDUCTIVE PASTE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC PARTS 发明申请

2023-05-29 5000 152K 0

专利信息

申请日期 2025-06-26 申请号 JP2009290846
公开(公告)号 JP2010257937A 公开(公告)日 2010-11-11
公开国别 JP 申请人省市代码 全国
申请人 TDK CORP
简介 PROBLEM TO BE SOLVED : To provide a conductive paste in which excessive growth of grains due to reaction between common materials with each other and reaction between the common materials and dielectric particles which form a dielectric layer can be suppressed even when the common materials mixed in the conductive paste are pulverized one, the conductive paste being capable of providing electronic parts with high reliability and same quality. SOLUTION : The conductive paste includes conductive powder, a solvent, a binder, and ceramic powder, and the ceramic powder includes dielectric powder having a perovskite structure which is coated with magnesium oxide, an oxide of alkaline earth metal excluding magnesium and an oxide of rare earth. COPYRIGHT : (C)2011, JPO&INPIT


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