客服热线:18202992950

Substrate processing system and method for monitoring occurrence of arcing during substrate processi 发明授权

2023-08-03 2040 106K 0

专利信息

申请日期 2025-07-09 申请号 JP2004307503
公开(公告)号 JP4576200B2 公开(公告)日 2010-11-04
公开国别 JP 申请人省市代码 全国
申请人 Canon ANELVA Corporation227294
简介 PROBLEM TO BE SOLVED : To effectively prevent arcing as abnormal discharge generated in the case a member made arranged so as to be close to the periphery of a substrate such as a shadow ring is present. SOLUTION : In a process chamber 1, the deposition of a tungsten film 92 by sputtering is performed to a substrate 9 held to a substrate holder 3. The substrate 9 is electrostatically attracted on a dielectric plate 31 by voltage applied to an attracting electrode 32 by an attraction power source 33, and the deposition of a thin film from the periphery of the substrate 9 to a region in a prescribed distance is prevented by a shadow shield 62. An electrically conductive film 71 covering a part of the surface in the dielectric plate 31 is contacted with the rear face of the substrate 9 and is insulated from an earth, and is further short-circuited to the shadow shield 62 by wiring 76 for a short-circuiting. The electric potential of the electrically conductive film 71 is measured by a voltmeter 72, and the generation of arcing is judged by a judging means 74 from the rapid variation of the measured value in the voltmeter 72. COPYRIGHT : (C)2006, JPO&NCIPI


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4