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MANUFACTURING METHOD FOR LIGHT-EMITTING-DIODE SUBSTRATE 发明申请

2023-04-29 4140 164K 0

专利信息

申请日期 2025-06-25 申请号 JP2009083865
公开(公告)号 JP2010238834A 公开(公告)日 2010-10-21
公开国别 JP 申请人省市代码 全国
申请人 UBE INDUSTRIES
简介 PROBLEM TO BE SOLVED : To provide a practical manufacturing method for a light-emitting-diode substrate that allows a light-emitting diode to be formed on its surface and has a light-converting function for emitting light from the light-emitting diode by at least partially changing the wavelength of the light. SOLUTION : A light-emitting-diode substrate is formed by laminating a single-crystal layer allowing a light-emitting diode element to be formed thereon and a specific ceramic composite layer for light conversion containing a metal element oxide. The manufacturing process for the light-emitting-diode substrate is configured to comprise the steps of a step A for forming an ion implantation region by implanting hydrogen ions, rare-gas ions or both of them at a prescribed depth position from the surface of a single-crystal substrate allowing the light-emitting diode element to be formed thereon, a step B for laminating the single-crystal substrate and the ceramic composite substrate for light conversion such that the face subjected to ion implantation of the single-crystal substrate becomes the side of the ceramic composite substrate for light conversion, and a step C for executing layer-thinning of the single-crystal substrate by partially peeling off the single-crystal substrate with the ion implantation region as a boundary. COPYRIGHT : (C)2011, JPO&INPIT


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