客服热线:18202992950

A method of manufacturing a conductive material and plating solution 发明授权

2023-01-20 2070 156K 0

专利信息

申请日期 2025-07-11 申请号 JP2006096651
公开(公告)号 JP4548377B2 公开(公告)日 2010-09-22
公开国别 JP 申请人省市代码 全国
申请人 TDK Corporation3067
简介 PROBLEM TO BE SOLVED : To provide a plating liquid capable of forming a protective film excellent in adhesiveness, corrosion resistance and heat resistance on the surface of a conductive raw material such as rare earth magnet without corroding the conductive raw material such as rare earth magnet. SOLUTION : The plating liquid comprises a nickel salt compound and an amine compound which forms a complex with a nickel ion, and has pH 8 to 12. Molar ratio of the nickel ion to the amine compound is 1.0 to 3.0 times of coordination number of the amine compound to the nickel ion and stepwise formation constant K1of a primary step reaction when the amine compound forms the complex with the nickel ion preferably falls into the range of K1= 4.0 to 15.0. COPYRIGHT : (C)2008, JPO&INPIT


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4