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Adhesive for metal bonding applications 发明授权

2023-09-13 2590 2109K 0

专利信息

申请日期 2025-08-29 申请号 AU2006243787
公开(公告)号 AU2006243787B2 公开(公告)日 2010-09-16
公开国别 AU 申请人省市代码 全国
申请人 ILLINOIS TOOL WORKS INC
简介 (57) Abstract : Adhesive formulations having acrylate monomer or methacrylate monomer, or mixtures thereof, and having a re ducing agent and an initiator (e.g., peroxide). The formulations may include a chelating agent solution to improve storage stability and other properties. Further, the mole ratio of the initiator to the reducing agent may be adjusted to control weight loss of the adhesives during cure. Polyvinyl acetate or its derivatives may also be employed in the adhesive formulations to reduce weight loss during cure. Moreover, certain embodiments of the formulations include a tougheningagent copolymer having a glass transition temperature (of at least one domain) that is lower than -50°C (-58°F). These toughening-agent copolymers may be added to the adhesive formulations to improve impact strength and other properties of the cured adhesives at lower temperatures, e.g., 40°C (40°F), while maintaining performance of the cured adhesives at higher temperatures, e.g., 82°C (180°F).


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