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Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing ma 发明授权

2023-01-09 4880 750K 0

专利信息

申请日期 2026-04-28 申请号 US11262897
公开(公告)号 US7784764B2 公开(公告)日 2010-08-31
公开国别 US 申请人省市代码 全国
申请人 Takaki Kuno; Yoshinori Noguchi; Keiji Maeda; Seiichi Suda; Satoshi Kitaoka; Naoki Kawashima; Masato Yoshiya
简介 A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.


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