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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 发明申请

2022-12-28 3670 326K 0

专利信息

申请日期 2025-06-27 申请号 JP2009026604
公开(公告)号 JP2010182964A 公开(公告)日 2010-08-19
公开国别 JP 申请人省市代码 全国
申请人 TOSHIBA CORP
简介 PROBLEM TO BE SOLVED : To provide a semiconductor device having a gate insulating film which has a high dielectric constant and can reduce a leakage current. SOLUTION : The semiconductor device includes a first dielectric film 23 provided on a semiconductor substrate 11 and containing lantern aluminum silicon oxide or oxynitride, a second dielectric film 24 provided on the first dielectric film 23 and containing oxide or oxynitride containing at least one of hafnium (Hf), zirconium (Zr), titanium (Ti), and rare-earth metal, and an electrode 14 provided on the second dielectric film 24. COPYRIGHT : (C)2010, JPO&INPIT


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