| 简介 |
The invention relates to thermoplastic molding compounds containing A) 10 to 99.99 wt % of a polyoxymethylene homopolymer or copolymer, B) 0.01 to 5 wt % of an imidazole of the general formula (I), wherein the groups R1 to R4 have the following meaning independently of each other : R1 is an alkyl group having 1 to 5 C atoms, R2 to R4 are hydrogen, an alkyl group having 1 to 5 C atoms, C) 0 to 5 wt % of an alkaline-earth oxide, D) 0 to 80 wt % of further additives, wherein the total of the weight percentages of the components A) to D) is 100%. |
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