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Plating method 发明授权

2023-04-10 3830 46K 0

专利信息

申请日期 2026-04-23 申请号 JP2000099274
公开(公告)号 JP4505934B2 公开(公告)日 2010-07-21
公开国别 JP 申请人省市代码 全国
申请人 Hitachi Metals Ltd5083
简介 PROBLEM TO BE SOLVED : To provide an agitation type plating method which enables suppression of generation of cracks and chipping of a work such as a rare earth metal permanent magnet during the electric plating by the agitation type electric plating method or during the electroless plating by the agitation type electroless plating method and formation of a uniform plating film, and improvement in the productivity. SOLUTION : Plating is performed by accommodating the media and a holder holding the work in an agitation vessel.


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