| 简介 |
PURPOSE : An Al-group alloy sputtering target and a manufacturing method thereof are provided to increase deposition rate by controlling crystal orientation vertically to the surface of sputtering.CONSTITUTION : An Al-group alloy sputtering target contains Ni 0.05-10 atomic%%. When vertical direction crystal orientation, , and are observed by the electron back-scatter diffraction pattern method on the sputtering surface of the Al-system alloy sputtering target The Al- system alloy sputtering target additionally contains rare earth materials 0.1-2 atomic%%.COPYRIGHT KIPO 2010 |
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